UFS 3.1 | Universal Flash Storage | Samsung Semiconductor Global
UFS 3.1 typically supports a 2-lane configuration (2 TX and 2 RX pairs), doubling the bandwidth compared to single-lane setups. Power Supply Pins
UFS 3.1 utilizes a high-speed, serial bi-directional interface based on the MIPI M-PHY physical layer and the UniPro link layer protocol. Unlike older eMMC storage, which uses a parallel bus topology (sharing data lines), UFS utilizes dedicated differential lanes for transmitting and receiving data simultaneously (Full-Duplex). Key Advancements in UFS 3.1: ufs 3.1 pinout
To find the pinout for a particular device:
Note: In single-lane configurations (common in mid-range devices), only Lane 0 is active. Key Advancements in UFS 3
UFS 3.1 chips primarily deploy in two standard JEDEC form factors:
UFS 4.0 was ratified by JEDEC in 2022, offering double the bandwidth of UFS 3.1 and continuing the trend of ever‑higher performance. However, the BGA153 footprint is expected to remain for compatibility reasons. Many of the layout guidelines presented here will still apply, albeit with stricter requirements on signal integrity and power distribution. Many of the layout guidelines presented here will
Receiver differential pair for Lane 0 ( DIN0_t , DIN0_c ) and Lane 1 ( DIN1_t , DIN1_c ). This handles data sent from the host processor to the storage chip.